Summary and Call for Proposals

Joint Usage / Research Center

Joint Usage/Research Center of materials and systems for innovative energy management

IMaSS has been designated by the Ministry of Education, Culture, Sports, Science and Technology （MEXT） as a "Joint Usage/Research Center of materials and systems for innovative energy management." Through joint usage and research related to energy management technologies, it serves as a venue for everything from fundamental research through to system-building for actual deployment in society, aimed at more advanced, fully optimized energy creation, conversion, storage, transmission and utilization. At this facility, researchers from universities, research institutions and other organizations based in Japan and abroad can engage in joint research together with IMaSS personnel while utilizing a wide range of equipment including film-deposition systems, micro/nano-fabrication equipments, electron microscopes and many other types of analysis instruments, and more. If you wish to apply for joint usage or research at this facility, please consult with the IMaSS staff in advance and apply.

Facilities and Equipment

Coating Equipment

Facilities and Equipment	Specifications	Inquiry
Magnetron sputtering with 8 sources	8 cathodes with 2 inches Sample size : 30x30 mm2 RF power sources : 500 W x 2 Sample heating : <600˚C Ar ion etching source : <1 kV Sample exchange chamber with 8 samples banking	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
MBE with 8 sources	E-beam souces : 4cc x 4 and 2cc x 2 Sample size : 30x30 mm2 High voltage power souces : 3 Sample heating : <1000˚C Ar ion etching source : <1 kV RHEED with 25 kV	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
Magnetron sputtering with 3 sources	Shimadzu HSR-522 3 cathodes with 4 inches RF power sources : 500 W x 2 Reverse sputtering of sample, Sample rotation, Multi-layered deposition	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp

Microfabrication/Processing Device

Facilities and Equipment	Specifications	Inquiry
Electron beam lithography	JEOL JBX6300FS Accelerating voltage:25/50/100kV Minimum beam diameter:2nm Beam current:100pA-2nA Superimposing Accuracy:±9nm Maximum sample size:8inchφ	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
Mask aligner	Canon PLA-501(S) Indefinite shape sample with thickness less than 0.7μm	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
ECR etching with SIMS	ECR ion source:Irie Koken RGB-114 Microwave input power:150 W, Accelerating voltage:600 V，Ion beam diameter:30mm SSIMS analyzer:PFEIFFER EDP400 Mass analysis range:1-512 amu Sample rotation and tilting mechanism	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
Ion implantation	NISSIN Electric NH-20SR-WMH Accelerating voltage:5-200kV Beam current:1 µA～100 µA	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
Femto-second laser for micro-fabrication and measurement	Kisou UFL-Hybrid System Pulse Laser:1041 nm, 550 fs, 10 µJ (IMRA µjewel D-1000) Harmonic generator:40% @520 nm, 5% @347 nm (Micro-fabrication Station) Maximum sample size:100 mm x 100 mm Laser beam diameter for fabrication:3.5 µmφ (Measurment Station) Time resolved fluorescent, Spin dynamics of magnetic materials (Optical Coherence Tomography Station) Observation area:10 mm x 10 mm x 1.6 mm Depth resolution:7 µm	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
Electric furnace	Koyo Thermo System Co. MODEL272-2 Temperature range:400-1100˚C	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
Rapid thermal annealing	AG Associates Heatpulse 610 Temperature range:400～1200˚C Temperature rasing rate:200˚C/sec	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp

Electronic Microscope & Associated Equipment

Facilities and Equipment	Specifications	Inquiry
Reaction science high voltage scanning TEM JEM1000K RS	Acc. Vol.: 1000 kV (400, 600, 800 kV on demand) Electron gun: Thermal (LaB6) Mode: TEM/STEM Anal. Tool: GIF (Quantum equivalent) Recording: CCD (wide and high-res.) Specimen holder: cooling, heating, cryo-transfer, nano-indentation, 3D tomography, other custom-made holders E-cell: O2, N2, CO, H2,… up to 10,000 Pa	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Aberration corrected scanning TEM JEM ARM200F	Acc. Vol.: 200 kV, 80 kV Electron gun: Schottky FEG Mode: TEM/STEM Cs correction: probe & imaging Anal. Tool: EDX (SDD: 60 mm2), GIF Quantum Recording: CCD Specimen holder: single-tilt, double-tilting, double-tilting Be analytical Others: Bi-prism for holography, BSI detector	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Transmission electron microscope JEM2100F-HK	Acc. Vol.: 200 kV, 80 kV Electron gun: Schottky FEG Mode: TEM/STEM Cs correction: probe & imaging Anal. Tool: EDX (SDD: 60 mm2), GIF Quantum Recording: CCD Specimen holder: single-tilt, double-tilting, double-tilting Be analytical Others: Bi-prism for holography, BSI detector	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Transmission electron microscope JEM2100F-HK	Acc. Vol.: 200kV Electron gun: Schottky FEG Mode: TEM/STEM Anal. Tool: EDX (SDD: 60 mm2) Recording: CCD Specimen holder: double-tilting cooling, double-tilting heating, multi-sample, Be analytical	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Transmission Electron Microscope JEM-2100plus	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Electron Spectroscopic scanning TEM JEM2100M	Acc. Vol.: 80-200 kV Electron gun: Thermal (LaB6) Mode: TEM/STEM Anal. Tool: EDX (SDD: 30 mm2), WDX, EELS (Enfina), CL Recording: CCD Specimen holder: single-tilt, double-tilting, double-tilting Be analytical, rotation, cooling & heating Others: BSI detector	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
High-speed sample fabrication/analysis system MI-4000L	Acc vol.:30kV (FIB, SEM) Anal. Tool: FE-SEM、EDS, EDSD Micro-sampling, Slice & See	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Focused ion beam sample preparation system FB-2100	Acc vol.:40kV Micro-sampling	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Precision ion beam milling system PIPS II	Ion energy: 100 eV～8 keV Attachments: Digitally zooming microscope, specimen cooling stage	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Other instruments for sample preparation	Low speed blade saw, wire saw, mechanical lapping system, jet polishing (EcoPol), ultramicrotomy, Cross-section polisher, Dimpling machine, Gentle mill, ion coating machine, etc	High voltage electron microscope laboratory hvem@nagoya-microscopy.jp
Field-emission scanning electron microscope	JEOL JSM-6330F & JED-2140GS	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
エネルギー分散型X線分析装置付走査型電子顕微鏡日立ハイテクノロジーズ S3000N	SEMEDXⅢTypeN1 SEI像分解能：3.0nm@ 25kV COMPO像分解能：4.0nm 加速電圧：0.3～30kV	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
透過電子顕微鏡システム日本電子 JEM-2010F	加速電圧200kV 点分解能0.19nm STEM機能	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
FE-SEM	JEOL JSM-6301F Field-emission electron gun Accelerating voltage: 0.5～30kV Magnification: 10～500,000 Analysis with energy dispersive X-ray spectrometry	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp

Analysis Measurement Equipment

Facilities and Equipment	Specifications	Inquiry
X-ray diffractometer	RIGAKU ATX-G X-ray sourse : Cu-Ka, 18kW Multilayered focusing mirror Ge monochromater θ-2θscan mode，Rocking curve，Reciprocal lattice mapping, In-plane φ scan，φ－2θχscan	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
X-ray diffractometer	RIGAKU RINT2500TTR	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
Atomic force microscope	Bruker, AXS Dimension3100 Scan range:XY axes 90μm，Z axis 6μm Maximum sample size:150 mmφ－12mmt Measurement mode : AFM，MFM，EFM，LFM，surface electric potential image，current image，lithography	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
Magnetometers	Alternative gradient force magnetometer, sensitivity :10^-8emu，maximum field : 20kOe Vibrating sample magnetometer, sensitivity :10^-5emu，maximum field : 15kOe Torque magnetometer:sensitivity :2×10^-3erg，maximum field : 15kOe Magneto-optical spectrometer, sensitivity :2×10^-3deg，maximum field : 16kOe	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
X-ray photoelectron spectrometer	VG ESCALAB250 Mg/Al twin anode and Al monochromator X ray source Sample etching by Ar ion gun Manipultor for angle resolved measurement	Nano fabrication Platform info@nanofab.engg.nagoya-u.ac.jp
X-ray photoelectron spectrometer	SHIMADZU ESCA-3300	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
イメージングXPSマイクロプローブサーモフィッシャー ESCALAB 250Xi	UPS, XPS両光電子分光計測が可能 XPS計測時：Mg, Al ツインアノード利用可最高エネルギー分解能： 0.5eV程度＠Alkα 最高空間分解能：20μm	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
Inductively Coupled Plasma Atomic Emission Spectrometer	Seiko Instruments, SPS7800	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
CHN coder	(Yanaco) MT-6	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp
Laser doppler velocimeter for one velocity component	1D-PDPA/FSA3500P	Shared Equipment Office shared.equip@imass.nagoya-u.ac.jp

Center for Integrated Research of Future Electronics / Center for Integrated Research of Future Electronics, Transformative Electronics Facilities

	Facilities and Equipment	Specifications	Inquiry
	Ion implanter ULVAC IMX-3500		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	High Temperature Sputtering Deposition Equipment ULVAC QAM4		HONDA, Assoc. Prof.
	FIB-SEM HITACHI NX2000		HONDA, Assoc. Prof.
	In-lens SEM HITACHI SU9000		HONDA, Assoc. Prof.
	Imaging CL HORIBA WD201N		HONDA, Assoc. Prof.
	Work function measuring device RIKEN KENKI AC-3		HONDA, Assoc. Prof.
	Emission microscope HAMAMATSU PHOTONICS PHEMOS-1000		HONDA, Assoc. Prof.
	i-line stepper Nikon NSR-2205i12D		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	Nano inprint equipment SCIVAX X-500		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	Laser Confocal Microscope Olympus OLS-4100		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	RCA cleaning system Dalton 18-MR 12		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	Organic cleaning system Dalton 18-MU11		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	Stylus profiler Bruker Dektak XT-A		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	ICP etching system 4 ULVAC CE-S		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	Atomic layer deposition system (Plasma/Thermal) Ultratech/CambridgeNanoTech　Fiji G2		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	LP-CVD samco LPD-1200		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	ICP etching system 1 samco RIE-200iP		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	ICP etching system 2 samco RIE-200iP		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	P-CVD1 samco PD-220NL		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	ICP etching system 3 ULVAC NE-550EX		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	EB evaporator ULVAC ei-5		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	Sputtering system ULVAC CS-L		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	Automated Thickness Mapping Systems FILMETRICS F50		C-TEFs c-tefs@imass.nagoya-u.ac.jp
	West bond 7200CR		HONDA, Assoc. Prof.
	TECDIA TEC-2004TMR		HONDA, Assoc. Prof.
	Nanofactor Fact-200		HONDA, Assoc. Prof.
	West bond 7476D		HONDA, Assoc. Prof.