Joint Usage / Research Center
Summary and Call for Proposals
Image of Shared Use
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Academics or research teams of the IMaSS including
researchers from other institutes/universities.Nagoya University researchers
Researchers from other universities(research representatives)
▼
Joint research by utilizing the facilities, equipment, data and other items of the IMaSS.
Wide range of research from fundamental research on advanced materials and devices to
systems engineering for their social implementation.▼
Realization of the development of environment-friendly and sustainable energy-saving and energy-creating technologies
(energy conversion, energy storage, energy transmission, and sophisticated and ultraefficient energy consumption).
Summary and Call for Proposals
Joint Usage/Research Center of materials and systems for innovative energy management
IMaSS has been newly certified as a "Joint Usage/Research Center of energy-friendly and sustainable energy-saving and energy-creating materials and systems research" by the Ministry of Education, Culture, Sports, Science and Technology for 6 years from FY2022, and it is aimed at realizing the development of environment-friendly and sustainable energy-saving and energy-creating technologies (energy conversion, energy storage, energy transmission, and sophisticated and ultraefficient energy consumption). To realize the development of energy-saving and energy-creating technologies, the center further promotes energy-saving and energy-creating technologies through joint usage/joint research by domestic and oversea researchers. At this facility, researchers from universities, research institutions and other organizations based in Japan and abroad can engage in joint research together with IMaSS personnel while utilizing a wide range of equipment including film-deposition systems, micro/nanofabrication equipment, electron microscopes and many other types of analysis instruments.
If you wish to apply for joint usage or research at this facility, please consult the IMaSS staff in advance and apply.
Facilities and Equipment
Coating Equipment
| Facilities and Equipment | Specifications | Inquiry | |
|---|---|---|---|
|
Magnetron sputtering with 8 sources | 8 cathodes with 2 inches Sample size : 30x30 mm2 RF power sources : 500 W x 2 Sample heating : <600˚C Ar ion etching source : <1 kV Sample exchange chamber with 8 samples banking |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
MBE with 8 sources | E-beam souces : 4cc x 4 and 2cc x 2 Sample size : 30x30 mm2 High voltage power souces : 3 Sample heating : <1000˚C Ar ion etching source : <1 kV RHEED with 25 kV |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
Magnetron sputtering with 3 sources | Shimadzu HSR-522 3 cathodes with 4 inches RF power sources : 500 W x 2 Reverse sputtering of sample, Sample rotation, Multi-layered deposition |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
Microfabrication/Processing Device
| Facilities and Equipment | Specifications | Inquiry | |
|---|---|---|---|
|
Electron beam lithography | JEOL JBX6300FS Accelerating voltage:25/50/100kV Minimum beam diameter:2nm Beam current:100pA-2nA Superimposing Accuracy:±9nm Maximum sample size:8inchφ |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
Mask aligner | Canon PLA-501(S) Indefinite shape sample with thickness less than 0.7μm |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
ECR etching with SIMS | ECR ion source:Irie Koken RGB-114 Microwave input power:150 W, Accelerating voltage:600 V，Ion beam diameter:30mm SSIMS analyzer:PFEIFFER EDP400 Mass analysis range:1-512 amu Sample rotation and tilting mechanism |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
Ion implantation | NISSIN Electric NH-20SR-WMH Accelerating voltage:5-200kV Beam current:1 µA～100 µA |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
Femto-second laser for micro-fabrication and measurement | Kisou UFL-Hybrid System Pulse Laser:1041 nm, 550 fs, 10 µJ (IMRA µjewel D-1000) Harmonic generator:40% @520 nm, 5% @347 nm (Micro-fabrication Station) Maximum sample size:100 mm x 100 mm Laser beam diameter for fabrication:3.5 µmφ (Measurment Station) Time resolved fluorescent, Spin dynamics of magnetic materials (Optical Coherence Tomography Station) Observation area:10 mm x 10 mm x 1.6 mm Depth resolution:7 µm |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
Electric furnace | Koyo Thermo System Co. MODEL272-2 Temperature range:400-1100˚C |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
Rapid thermal annealing | AG Associates Heatpulse 610 Temperature range:400～1200˚C Temperature rasing rate:200˚C/sec |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
Electronic Microscope & Associated Equipment
| Facilities and Equipment | Specifications | Inquiry | |
|---|---|---|---|
|
Reaction science high voltage scanning TEM JEM1000K RS |
Acc. Vol.: 1000 kV (400, 600, 800 kV on demand) Electron gun: Thermal (LaB6) Mode: TEM/STEM Anal. Tool: GIF (Quantum equivalent) Recording: CCD (wide and high-res.) Specimen holder: cooling, heating, cryo-transfer, nano-indentation, 3D tomography, other custom-made holders E-cell: O2, N2, CO, H2,… up to 10,000 Pa |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Aberration corrected scanning TEM JEM ARM200F |
Acc. Vol.: 200 kV, 80 kV Electron gun: Schottky FEG Mode: TEM/STEM Cs correction: probe & imaging Anal. Tool: EDX (SDD: 60 mm2), GIF Quantum Recording: CCD Specimen holder: single-tilt, double-tilting, double-tilting Be analytical Others: Bi-prism for holography, BSI detector |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Transmission electron microscope JEM2100F-HK |
Acc. Vol.: 200 kV, 80 kV Electron gun: Schottky FEG Mode: TEM/STEM Cs correction: probe & imaging Anal. Tool: EDX (SDD: 60 mm2), GIF Quantum Recording: CCD Specimen holder: single-tilt, double-tilting, double-tilting Be analytical Others: Bi-prism for holography, BSI detector |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Transmission electron microscope JEM2100F-HK |
Acc. Vol.: 200kV Electron gun: Schottky FEG Mode: TEM/STEM Anal. Tool: EDX (SDD: 60 mm2) Recording: CCD Specimen holder: double-tilting cooling, double-tilting heating, multi-sample, Be analytical |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Transmission Electron Microscope JEM-2100plus |
Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Electron Spectroscopic scanning TEM JEM2100M |
Acc. Vol.: 80-200 kV Electron gun: Thermal (LaB6) Mode: TEM/STEM Anal. Tool: EDX (SDD: 30 mm2), WDX, EELS (Enfina), CL Recording: CCD Specimen holder: single-tilt, double-tilting, double-tilting Be analytical, rotation, cooling & heating Others: BSI detector |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
High-speed sample fabrication/analysis system MI-4000L |
Acc vol.:30kV (FIB, SEM) Anal. Tool: FE-SEM、EDS, EDSD Micro-sampling, Slice & See |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Focused ion beam sample preparation system FB-2100 |
Acc vol.:40kV Micro-sampling |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Precision ion beam milling system PIPS II |
Ion energy: 100 eV～8 keV Attachments: Digitally zooming microscope, specimen cooling stage |
High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Other instruments for sample preparation | Low speed blade saw, wire saw, mechanical lapping system, jet polishing (EcoPol), ultramicrotomy, Cross-section polisher, Dimpling machine, Gentle mill, ion coating machine, etc | High voltage electron microscope laboratory hvem*@*nagoya-microscopy.jp |
|
Field-emission scanning electron microscope | JEOL JSM-6330F & JED-2140GS | Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
エネルギー分散型X線分析 装置付走査型電子顕微鏡 日立ハイテクノロジーズ S3000N |
SEMEDXⅢTypeN1 SEI像分解能：3.0nm@ 25kV COMPO像分解能：4.0nm 加速電圧：0.3～30kV |
Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
透過電子顕微鏡システム 日本電子 JEM-2010F |
加速電圧200kV 点分解能0.19nm STEM機能 |
Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
FE-SEM | JEOL JSM-6301F Field-emission electron gun Accelerating voltage: 0.5～30kV Magnification: 10～500,000 Analysis with energy dispersive X-ray spectrometry |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
Analysis Measurement Equipment
| Facilities and Equipment | Specifications | Inquiry | |
|---|---|---|---|
|
X-ray diffractometer | RIGAKU ATX-G X-ray sourse : Cu-Ka, 18kW Multilayered focusing mirror Ge monochromater θ-2θscan mode，Rocking curve，Reciprocal lattice mapping, In-plane φ scan，φ－2θχscan |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
X-ray diffractometer | RIGAKU RINT2500TTR | Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
Atomic force microscope | Bruker, AXS Dimension3100 Scan range:XY axes 90μm，Z axis 6μm Maximum sample size:150 mmφ－12mmt Measurement mode : AFM，MFM，EFM，LFM，surface electric potential image，current image，lithography |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
Magnetometers | Alternative gradient force magnetometer, sensitivity :10^-8emu，maximum field : 20kOe Vibrating sample magnetometer, sensitivity :10^-5emu，maximum field : 15kOe Torque magnetometer:sensitivity :2×10^-3erg，maximum field : 15kOe Magneto-optical spectrometer, sensitivity :2×10^-3deg，maximum field : 16kOe |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
X-ray photoelectron spectrometer | VG ESCALAB250 Mg/Al twin anode and Al monochromator X ray source Sample etching by Ar ion gun Manipultor for angle resolved measurement |
Nano fabrication Platform info*@*nanofab.engg.nagoya-u.ac.jp |
|
X-ray photoelectron spectrometer | SHIMADZU ESCA-3300 | Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
イメージングXPSマイクロ プローブ サーモフィッシャー ESCALAB 250Xi |
UPS, XPS両光電子分光計測が可能 XPS計測時：Mg, Al ツインアノード 利用可 最高エネルギー分解能： 0.5eV程度＠Alkα 最高空間分解能：20μm |
Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
Inductively Coupled Plasma Atomic Emission Spectrometer | Seiko Instruments, SPS7800 | Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
CHN coder | (Yanaco) MT-6 | Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
|
Laser doppler velocimeter for one velocity component | 1D-PDPA/FSA3500P | Shared Equipment Office shared.equip*@*imass.nagoya-u.ac.jp |
Center for Integrated Research of Future Electronics / Center for Integrated Research of Future Electronics, Transformative Electronics Facilities
| Facilities and Equipment | Specifications | Inquiry | |
|---|---|---|---|
|
Ion implanter ULVAC IMX-3500 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
|
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High Temperature Sputtering Deposition Equipment ULVAC QAM4 |
HONDA, Assoc. Prof. | |
|
FIB-SEM HITACHI NX2000 |
HONDA, Assoc. Prof. | |
|
In-lens SEM HITACHI SU9000 |
HONDA, Assoc. Prof. | |
|
Imaging CL HORIBA WD201N |
HONDA, Assoc. Prof. | |
|
Work function measuring device RIKEN KENKI AC-3 |
HONDA, Assoc. Prof. | |
|
Emission microscope HAMAMATSU PHOTONICS PHEMOS-1000 |
HONDA, Assoc. Prof. | |
|
i-line stepper Nikon NSR-2205i12D |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
|
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Nano inprint equipment SCIVAX X-500 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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Laser Confocal Microscope Olympus OLS-4100 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
|
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RCA cleaning system Dalton 18-MR 12 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
|
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Organic cleaning system Dalton 18-MU11 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
|
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Stylus profiler Bruker Dektak XT-A |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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ICP etching system 4 ULVAC CE-S |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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Atomic layer deposition system (Plasma/Thermal) Ultratech/CambridgeNanoTech Fiji G2 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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LP-CVD samco LPD-1200 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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ICP etching system 1 samco RIE-200iP |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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ICP etching system 2 samco RIE-200iP |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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P-CVD1 samco PD-220NL |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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ICP etching system 3 ULVAC NE-550EX |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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EB evaporator ULVAC ei-5 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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Sputtering system ULVAC CS-L |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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Automated Thickness Mapping Systems FILMETRICS F50 |
C-TEFs c-tefs*@*imass.nagoya-u.ac.jp |
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West bond 7200CR | HONDA, Assoc. Prof. | |
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TECDIA TEC-2004TMR | HONDA, Assoc. Prof. | |
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Nanofactor Fact-200 | HONDA, Assoc. Prof. | |
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West bond 7476D | HONDA, Assoc. Prof. |
Please drop *'s before/after @ in sending e-mail.
Joint Research List（PDF）
