Award date | 2024/03/14 |
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Award | The 37th Japan Institute of Electronics Packaging (JIEP) Spring Conference Excellence Award |
Winners | Mr. Kazuhito NAKAMURA(D3, Yamamoto Lab), Associ. Prof. Jun IMAOKA & Prof, Masayoshi YAMAMOTO |
Research topics | Design, Prototyping and Evaluation of SiC Half-bridge Circuit using Power Device Embedded Module Process |
Related HP |
https://jiep.or.jp/event/convention/jiep2024s/awards/index.php Power Electronics Lab |
Information & Topics
Awards List